Devices and methods for processing singulated radio-frequency units

ABSTRACT

Devices and methods for processing singulated radio-frequency (RF) units. In some embodiments, a device for processing singulated RF packages can include a plate having a plurality of apertures. Each aperture can be dimensioned to receive and position a singulated RF package to thereby facilitate processing of the singulated RF packages positioned in their respective apertures. In some embodiments, such a device can be utilized to batch process high volume of RF packages as if the RF packages are still in a panel format.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Application Nos.61/992,156 filed May 12, 2014, entitled RADIO-FREQUENCY DEVICES PACKAGEDON CERAMIC SUBSTRATES, AND APPARATUS AND METHODS FOR HIGH VOLUMEMANUFACTURING, and 62/031,816 filed Jul. 31, 2014, entitled DEVICES ANDMETHODS RELATED TO PROCESSING SINGULATED RADIO-FREQUENCY UNITS, thedisclosure of each of which is hereby expressly incorporated byreference herein in its entirety.

BACKGROUND

1. Field

The present disclosure relates to fabrication of packaged electronicmodules such as radio-frequency (RF) modules.

2. Description of the Related Art

In radio-frequency (RF) applications, RF circuits and related devicescan be implemented in a packaged module. Such a packaged module can thenbe mounted on a circuit board such as a phone board.

SUMMARY

According to a number of implementations, the present disclosure relatesto a device for processing singulated radio-frequency (RF) packages. Thedevice includes a plate having a plurality of apertures, with eachaperture being dimensioned to receive and position a singulated RFpackage to thereby facilitate processing of the singulated RF packagespositioned in their respective apertures.

In some embodiments, each of the apertures can have a rectangular shapehaving dimensions selected to allow the receiving and positioning of thesingulated RF package therein. The dimensions of the rectangular shapeof the aperture can be selected to provide sufficiently accuratepositioning of the singulated RF package relative to the plate. Theaperture can include a relief feature at one or more corners of therectangular shaped aperture, with each relief feature being dimensionedto allow fitting of a corresponding corner of the singulated RF package.In some embodiments, each of the four corners of the aperture caninclude the relief feature.

In some embodiments, the plate can include one or more featuresconfigured to provide indexing and/or alignment functionality. The platecan have, for example, a rectangular shape. At least some of the one ormore indexing/alignment features can be positioned along a selected edgeof the rectangular plate.

In some embodiments, the plate can include an upper side and a lowerside. The lower side can be configured to receive a tape such that theapertures expose respective portions of an adhesive side of the tape tothereby facilitate holding of the singulated RF packages positioned inthe apertures. The tape can be configured to withstand conditionsassociated with the processing of the singulated RF packages. The platecan include one or more tape-removal features configured to facilitateremoval of the tape from the lower side of the plate. The one or moretape-removal features can include one or more notches implemented on aselected edge of the plate.

In some embodiments, the plate can have a wafer-like shape. Theapertures can be dimensioned to receive and position the singulated RFpackages to facilitate a conformal shield deposition process. Theconformal shield deposition process can include a sputter depositionprocess.

In some embodiments, the plate can have a thickness selected to allowthe singulated RF packages to be positioned and retained in theirrespective apertures in a desired manner during the processing of thesingulated RF packages. The singulated RF packages can be, for example,shielded RF packages. Each of the shielded RF packages can include aconformal shielding layer that covers an upper surface and at least someside walls of the shielded RF package. The thickness can be selected toallow the shielded RF packages to be positioned in their respectiveapertures in an inverted orientation to allow one or more process stepsto be performed on undersides of the shielded RF packages. The shieldedRF packages can be configured to yield dual-sided RF packages.

In some embodiments, the singulated RF packages can be un-shielded RFpackages. The thickness of the plate can be selected to allow formationof a conformal shielding layer that covers an upper surface and at leastsome side walls of the singulated RF package.

In some teachings, the present disclosure relates to a method forprocessing singulated radio-frequency (RF) packages. The method includespositioning a plurality of singulated RF packages into respectiveapertures defined by a plate, such that the singulated RF packages areheld in a desired array. The method further includes performing one ormore process steps on the singulated RF packages while the singulated RFpackages are held by the plate.

In some embodiments, the method can further include applying a tape onone side of the plate prior to the positioning of the singulated RFpackages into the apertures, such that respective portions of anadhesive side of the tape are exposed through the apertures to therebyfacilitate the holding of the singulated RF packages. The singulated RFpackages can be, for example, shielded RF packages, Each shielded RFpackage can include a conformal shielding layer that covers an uppersurface and at least some side walls of the shielded RF package. Thepositioning can include placing an inverted shielded RF package into therespective aperture to allow the one or more process steps to beperformed on an underside of the shielded RF package. The shielded RFpackages can be configured to yield dual-sided RF packages, and the oneor more process steps can include mounting of a lower component on theunderside of the shielded RF package. The lower component can be, forexample, a semiconductor die. The lower component can be mounted to anunderside of a packaging substrate of the shielded RF package. Themethod can further include forming a ball-grid array (BGA) on theunderside of the packaging substrate, with the BGA being arrangedrelative to the lower component, and the BGA bein gdimensioned to allowthe shielded RF package to be mounted on a circuit board with the lowercomponent. The BGA can be arranged to form a perimeter around the lowercomponent.

In some embodiments, the method can further include holding each of thesingulated RF package on the side where the one or more process stepsare performed. Such a holding can include, for example, applying avacuum. The method can further include removing the tape from the platesuch that the relative positions of the singulated RF packages aremaintained by the vacuum. The tape is removed while the tape is abovethe plate. The method can further include removing the plate from thesingulated RF packages being held by the vacuum. The method can furtherinclude positioning the singulated RF packages at a selected location byreleasing the vacuum on the singulated RF packages. The positioning ofthe singulated RF packages can include substantially maintaining therelative positions of at least some of the singulated RF packages. Thepositioning of the singulated RF packages can include releasing thesingulated RF packages into a container.

In some embodiments, the method can further include applying vacuum tothe singulated RF packages positioned in their respective apertures ofthe plate. The method can further include applying a tape on one side ofthe plate after the singulated RF packages are being held by the vacuum,such that respective portions of an adhesive side of the tape engage theplate and portions of the singulated RF packages exposed through theapertures. The side on which the tape is applied can be opposite fromthe side of the plate on which the vacuum is applied to the singulatedRF packages. The method can further include removing the vacuum appliedto the singulated RF packages.

In some embodiments, the positioning of the singulated RF packages caninclude providing a loading plate above the plate to facilitate easierinsertion of the singulated RF packages into their respective aperturesof the plate. The loading plate can include a plurality of loadingapertures arranged to substantially match with the apertures of theplate. Each loading aperture can include side walls that are beveled tofacilitate the easier insertion.

In some embodiments, the performing of one or more process steps caninclude forming a conformal shielding layer on each singulated RFpackage while the singulated RF packages are held by the plate.

In some implementations, the present disclosure relates to a system forbatch processing of singulated radio-frequency (RF) packages. The systemincludes an apparatus configured for holding singulated RF packages. Theapparatus includes a plurality of frame carriers, with each framecarrier having a plurality of apertures dimensioned to receive andposition an array of singulated RF packages. The system further includesa handling apparatus configured to receive the plurality of framecarriers. Each frame carrier is loaded with the array of singulated RFpackages. The handling apparatus is further configured to allow batchprocessing of the singulated RF packages loaded in their respectiveframe carriers.

In some embodiments, the apparatus for holding singulated RF packagescan include a loading plate configured to be positioned over a framecarrier as the respective array of RF packages are being positioned inthe apertures. The loading plate can include a plurality of loadingapertures, with each loading aperture including beveled side wallsdimensioned to facilitate easier positioning of the RF package into thecorresponding aperture of the frame carrier.

In some embodiments, the handling apparatus can include a magazineconfigured to receive the plurality of loaded frame carriers. Themagazine can be further configured to facilitate the batch processing ofthe singulated RF packages loaded in the frame carriers as if they arestill in a panel format.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show side and plan views of a plurality of singleradio-frequency (RF) units being held together in an array.

FIG. 2 shows an example of a packaged RF module that can be fabricatedby having at least some portion of its fabrication process be performedafter being singulated from, for example, a panel format.

FIG. 3 shows another example of a packaged RF module that can befabricated by having at least some portion of its fabrication process beperformed after being singulated from, for example, a panel format.

FIGS. 4A-4D show various stages of an example fabrication process inwhich a significant portion of the process is performed after individualunits are singulated.

FIG. 5 shows a frame carrier having an array of apertures defined on aplate.

FIG. 6 shows an example process state where individual units arepositioned in their respective apertures of the frame carrier of FIG. 5.

FIG. 7A shows a plan view of a frame carrier that is similar to theexample of FIG. 5, but without a tape.

FIG. 7B shows a more detailed view of one of the apertures of the framecarrier of FIG. 7A.

FIG. 8A shows that in some embodiments, an aperture of a frame carriercan include relief features at some or all of the corners.

FIG. 8B shows an expanded view of one corner of the aperture of FIG. 8A.

FIG. 9 shows an example frame carrier having tape-removal notchesimplemented on a side edge.

FIG. 10 shows the frame carrier of FIG. 9 with a tape attached to itsunderside.

FIGS. 11A-11E show an example of how a plurality of individual units canbe loaded onto a frame carrier having one or more features as describedherein, and be processed as if the individual units are in a panelformat.

FIGS. 12A-12C show another example of how a plurality of individualunits can be loaded onto a frame carrier.

FIGS. 13A-13E show yet another example of how a plurality of individualunits can be loaded onto a frame carrier.

FIG. 14 shows that in some embodiments, a frame carrier having havingone or more features as described herein can have a shape other than arectangular shape.

FIG. 15 shows an example configuration where a selected annular regioncan define a plurality of apertures for holding singulated devicesduring a deposition process.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

In many manufacturing applications involving fabrication of packagedmodules such as radio-frequency (RF) modules, it is necessary ordesirable to perform at least some process steps on singulated units.Various examples related to such process steps on singulated units aredescribed herein in greater detail.

In some embodiments, some or all of the foregoing process stepsinvolving the singulated units can be facilitated by a frame carrierhaving one or more features as described herein. As also describedherein, such a frame carrier and related techniques can allow, forexample, high-volume processing of singulated units with desirableprecision. Although various examples are described herein in the contextof RF modules, it will be understood that one or more features of thepresent disclosure can also be implemented for processing of other typesof packaged electronic modules.

FIGS. 1A and 1B show side and plan views of a plurality of singleradio-frequency (RF) units 20 being held together in an array. Suchunits can be held together by, for example, an adhesive surface 12 of atape 10. Such units held by the tape 10 can be processed further.Examples of situations where processing of such units in singulated formare described herein in greater detail.

Depending on the type of operations and related handling processes, theforegoing technique of holding the single units (also referred to hereinas individual units) can be problematic. Described herein are devicesand methods that can allow processing of single units in an improvedmanner.

FIGS. 2 and 3 show non-limiting examples of packaged RF modules that canbe fabricated by having at least some portions of their fabricationprocesses be performed after being singulated from, for example, a panelformat (where an array of attached units are processed together). Ineach of the examples of FIGS. 2 and 3, a packaged RF module 100 includesa conformal shielding layer 174 that covers the upper surface and someor all of the side walls. Because of such side-wall coverage of theconformal shielding layer 174, it is desirable for the correspondingside wall to be exposed (e.g., by being separated from neighboringunit(s)) before application of the conformal shielding layer 174. Asidefrom the application of the conformal shielding layer 174, there may beadditional processing steps that can be performed on the single units toyield the packaged RF modules 100 such as the examples of FIGS. 2 and 3.

It is noted that various examples are described herein in the context ofside-wall application of conformal shielding layers, in whichsingulation prior to formation of such conformal shielding layers isdesirable. However, it will be understood one or more features of thepresent disclosure can also be applied to manufacturing processes thatdo not necessarily involve side-wall application of conformal shieldinglayers. For example, there may be other module fabrication techniques inwhich it is desirable to perform one or more processing steps afterindividual units are singulated.

FIG. 2 shows that in some embodiments, devices and methods related toprocessing of single units as described herein can be applied to asingle-sided RF module 100. For example, the module 100 is shown toinclude a packaging substrate 190 configured to receive one or morecomponents on one side (e.g., on the upper side). Such a packagingsubstrate can include, for example, a ceramic substrate such as alow-temperature co-fired ceramic (LTCC) substrate, or a laminatesubstrate. Such components mounted to the upper side of the packagingsubstrate 190 can include, for example, a surface-mount technology (SMT)component, a wirebond-connected semiconductor die, and/or a flip-chipdevice such as a wafer level chip scale package (WLCSP). Other types ofcomponents can also be mounted on the packaging substrate 190. In theexample of FIG. 2, such components are shown to be encapsulated by anovermold that provides the upper surface and parts of the side walls forthe conformal shielding layer 174.

The underside of the packaging substrate 190 can include, for example, aplurality of contact pads that are electrically connected to, forexample, some or all of the components mounted on the upper side. Someof such contact pads can also be electrically connected to a groundplane within the packaging substrate 190. In some embodiments, suchcontact pads can be pre-fabricated during the manufacturing of thepackaging substrate 190.

In the example of FIG. 2, one or more conductive features 170 are shownto be implemented in the packaging substrate 190, such that one end isin electrical contact with the conformal shielding layer 174. Althoughnot shown, the conductive features 170 are also electrically connectedto the ground plane within the packaging substrate. Accordingly, such anelectrical connection between the conformal shielding layer 174 and theground plane (through the conductive features 170) provides RF shieldingfunctionality for the module 100. Additional details concerning such ashielded module can be found in, for example, U.S. Patent ApplicationPublication No. 2015/0126134 entitled DEVICES AND METHODS RELATED TOPACKAGING OF RADIO-FREQUENCY DEVICES ON CERAMIC SUBSTRATES which ishereby expressly incorporated by reference herein in its entirety.

FIG. 3 shows that in some embodiments, devices and methods related toprocessing of single units as described herein can be applied todual-sided RF modules 100. For example, a module 100 in FIG. 3 is shownto include a packaging substrate 190 configured to receive one or morecomponents on one side (e.g., on the upper side), and one or morecomponents on the other side (e.g., on the lower side).

In some embodiments, the components mounted on the upper side of thepackaging substrates 190 in the example of FIG. 3 can be similar tothose described in reference to FIG. 2. Similarly, conformal shieldinglayers 174 and their respective conductive features 170 in the exampleof FIG. 3 can be similar to those described in reference to FIG. 2.

In the example of FIG. 3, the underside of the packaging substrate 190is shown to include a ball-grid array (BGA) 106 and a lower component104 mounted in an underside space defined by the packaging substrate 190and the BGA 106. Additional details concerning such a dual-sidedpackaged module can be found in U.S. Provisional Application No.62/031,815 entitled DUAL-SIDED RADIO-FREQUENCY PACKAGE HAVING BALL GRIDARRAY which is hereby expressly incorporated by reference herein in itsentirety.

FIGS. 4A-4D show various stages of an example fabrication process inwhich a significant portion of the process can be performed afterindividual units are singulated. It will be understood that suchindividual units can be for single-sided or dual-sided packages asdescribed herein.

In some embodiments, processing of most or all of upper and/or lowersides of a substrate panel can be achieved while the individual unitsremain together in a panel format. For example, modules that do notinclude conductive coating for side walls (e.g., to provide shielding)can have most or all of processing steps performed while in a panelformat. However, when one or more side walls include shielding features,at least some of processing steps related to such shielding need to beimplemented with the corresponding side wall(s) exposed. In someembodiments (e.g., where all four side walls include shieldingfeatures), at least some processing need to be performed on singulatedunits.

FIGS. 4A-4D show various states of an example process that can beimplemented to yield singulated units having shielding features on someor all side walls. Referring to FIG. 4A, a fabrication state 270 caninclude a panel 272 having a plurality of to-be-singulated units. Forexample, singulation can occur at boundaries depicted by dashed lines280 so as to yield singulated individual units. The panel 272 is shownto include a substrate panel 274 on which upper portions (collectivelyindicated as 276) are formed. Each unit of such an upper-portion panelcan include various parts described herein in reference to FIGS. 2 and3. Such parts can include various components mounted or implemented onthe substrate panel 274. The upper-portion panel 276 can also include anovermold layer which can be formed as a common layer for of theto-be-singulated individual units.

In the example of FIG. 4A, conductive features 278 are shown to beimplemented within the substrate panel 274. Each conductive feature 278can straddle the corresponding boundary 278, such than when separationoccurs at the boundary 278, each of the two exposed side walls of thesubstrates includes an exposed portion of the conductive feature 278that has been cut. Each of such a cut conductive feature is electricallyconnected to a ground plane (not shown) within the correspondingsubstrate.

Referring to FIG. 4B, a fabrication state 282 can include a plurality ofindividual units 284 resulting from singulations along the boundarylines (280 in FIG. 4A). As described above, each of the individual units284 includes side walls; and each side wall is shown to include anexposed portion of the cut conductive feature 278.

Referring to FIG. 4C, a fabrication state 286 can include the individualunits 284 being positioned for formation of a conformal conductivelayer. In some embodiments, the individual units 284 can be mounted on atape 288 to be temporarily held in place during the formation of theconformal conductive layer. The individual units 284 can be positionedwith sufficient spacing to allow effective formation of the conformalconductive layer on the side walls.

Referring to FIG. 4D, a fabrication state 290 can include formation of aconformal conductive layer 292 on the upper surface and the sidesurfaces of each of the individual units (284 in FIG. 4C) mounted on thetape 288. The conductive layer 292, in combination with the ground plane(connected through the conductive features 278), can provide shieldingfunctionality for a volume generally contained therein. In the exampleof FIG. 4D, each of the resulting individual units 294 can be any of theshielded packages described in reference to FIGS. 2 and 3.

For the examples of FIGS. 4A-4D, the side coverage of the conformalconductive layer on each unit necessitates or makes it desirable that atleast some steps be performed after the singulation step. Suchpost-singulation step(s) can include, for example, formation ofconformal conductive layer, as well as any further processing steps onupper and/or lower surfaces of the individual units.

FIGS. 5 and 6 show examples where a plurality of individual units can beprocessed together in an array. Such processing of the individual unitscan yield, for example, dual-sided packages of single-sided packages. Inthe context of dual-sided packages, additional details concerning suchindividual units can be found in the above-referenced U.S. ProvisionalApplication No. 62/031,815.

FIG. 5 shows a frame carrier 300 having a plate 304 with an array ofapertures 302. Each of such apertures can be dimensioned to receive anindividual unit, such that a plurality of such individual units can bearranged in an array for further processing. In FIG. 5, a tape 306 isshown to be provided underneath the frame carrier 300, such that anadhesive side engages the plate 304 and the apertures 302 expose thecorresponding portions of the adhesive side. Thus, an individual unitpositioned in an aperture 302 can be temporarily held in place by thetape 306.

FIG. 6 shows an example process state where individual units 294 arepositioned in their respective apertures 302 of the plate 304 of theframe carrier 300. In the example of FIG. 6, each individual unit 294 isdepicted as being mounted inverted such that the overmold is held by thetape 306 and its underside is exposed for further processing. Such anorientation can allow, for example, underside processing of individualunits to yield dual-sided packages. Once the individual units 294 arearranged in the foregoing manner, some or all of the subsequent stepscan be performed as if the units are in a panel format.

FIGS. 7-13 show more examples of the frame carrier 300 described inreference to FIGS. 5 and 6. As previously described, it will beunderstood that one or more features associated with the frame carrier300 can be utilized in various applications involving processing ofindividual units such as, for example, singulated units being processedto yield dual-sided packages with or without shielding functionality,and singulated units being processed to yield single sided packages withor without shielding functionality.

FIG. 7A shows a plan view of a frame carrier 300 that is similar to theexample of FIG. 5, but without the tape (306 in FIG. 5). The framecarrier 300 is shown to include a plate 304 that defines an array ofrectangular shaped apertures 302. FIG. 7B shows a more detailed view ofone of the apertures 302. It will be understood that other shapes canalso be implemented for the apertures 302.

The plate 304 can also define one or more features 430 configured toprovide indexing and/or alignment functionality. Such features can beutilized during, for example, loading and unloading of individual units,and processing of the individual units placed in the apertures 302.

In FIG. 7B, an aperture 302 is depicted as a rectangle having dimensionsd5 and d6. An individual unit 294 having dimensions d7 and d8 is shownto be positioned within the d5×d6 dimensions of the aperture 302.Preferably, the aperture's dimensions (d5×d6) are selected to allowprecise fit of the individual unit 294, but not too close to thedimensions (d7×d8) of the individual unit 294 to make loading andunloading difficult.

FIG. 8A shows that in some embodiments, each aperture 302 of a framecarrier 300 can include relief features 432 at some or all of thecorners. FIG. 8B shows an expanded view of one corner of the aperture302 of FIG. 8A.

In FIG. 8B, an individual unit 294 is shown to have a close fit withinthe rectangular boundary of the aperture 302. If the corner relieffeatures 432 are not present, each corner can have a radius due totolerances associated with formation of the aperture 302. Such a radiuscan interfere with fitting of a sharp corner 436 of the individual unit294.

As shown in FIG. 8B, the corner relief feature 432 can be dimensioned toprovide an opening 434 dimensioned to remove the corner radius.Accordingly, the individual unit 294 can fit closely within the aperture302 without the corners of the aperture 302 interfering with the sharpcorners 436 of the individual unit 294.

As described in reference to FIGS. 5 and 6, a tape attached to anunderside of a frame carrier (with the adhesive side exposed through theapertures) allows individual units to be positioned and held in theapertures for further processing. Preferably, such a tape is capable ofhandling high temperatures and/or cleaning operations. For example, ahigh-temperature silicone tape can withstand operations such as reflowoperations at a temperature of about 260° C., curing operations attemperatures from about 150° C. to about 200° C., solvent cleaningoperations, and plasma cleaning operations.

FIGS. 9-13 show that in some embodiments, a frame carrier 300 caninclude one or more tape-removal features such as notches to facilitateeasier removal of a tape from the underside of the frame carrier 300.FIG. 9 shows an example frame carrier 300 having three exampletape-removal notches 440 implemented on the left edge. Other features ofthe frame carrier 300 can be similar to the example of FIG. 7A.

FIG. 9 shows the frame carrier 300 without a tape. FIG. 10 shows theframe carrier 300 with a tape 306 attached to its underside. Moredetailed side views of a portion of one of the tape-removal notches 440and a nearby aperture 306 are shown in greater detail in FIG. 11 forexample processing steps.

In FIG. 11A, the tape 306 is shown to be attached to the underside ofthe plate 304 of the frame carrier 300, such that an adhesive side ofthe tape 306 is exposed through the aperture 302. As described herein,such a configuration allows an individual unit to be positioned andtemporarily held in place in the aperture 302 during further processing.As shown, an individual unit 294 is shown to be in the process of beingplaced (arrow 450) into the aperture 302.

In FIG. 11B, the individual unit 294 is shown to be positioned withinthe aperture 302 of the plate 304, and held therein by the tape 306. Itwill be understood that other individual units can be positioned andheld within their respective apertures of the plate 304. Accordingly,the plate 304 and the individual units 294 held within the respectiveapertures by the tape 306, collectively indicated as 320, can allow theindividual units to be further processed as if they are still in a panelformat.

FIG. 11C shows a state where processing of the underside of theindividual unit 294 has been completed. It will be understood that otherindividual units being held in the same frame carrier will also havetheir undersides processed. In FIG. 11C, the example undersideprocessing is shown to yield a lower component 104 and a BGA 106 beingimplemented on the underside of the individual unit 294. It will beunderstood that processing of other types of individual units can alsobe facilitated by the frame carrier 300.

FIG. 11D shows that, upon completion of such underside processing, theassembly of the array of processed individual units, the tape 306, andthe the plate 304 can be flipped. In such an orientation, the processedindividual units can be held in place by, for example, a vacuumapparatus 452. With the processed individual units held in place in sucha manner, the tape 306 can be removed from the underside of the plate304 (now facing upward) and the upper sides (also facing upward) of theprocessed individual units. As described herein, the tape-removalnotches 440 (FIGS. 9, 10) can facilitate easier removal of the tape 306.

FIG. 11E shows a state where the tape 306 has already been removed, andwhere the plate 304 is also being removed (arrow 454). Such a removal ofthe plate 304 is shown to leave an array of processed individual unitsheld in place by the vacuum apparatus 452. Such an array of processedindividual units can be, for example, flipped and placed into a filmframe, tray or bulk container, etc., depending on a particular process.

In the foregoing example of FIGS. 11A-11E, individual units 294 areshown to be loaded onto the frame carrier 300 in FIG. 11A so as to yieldthe assembly 320 of FIG. 320. More particularly, a given individual unit294 is shown to be placed into the corresponding aperture 302, to beadhered to the tape 306 already in place. FIGS. 12 and 13 shownon-limiting examples of how such loading of the frame carrier 300 canbe varied.

FIGS. 12A-12C show an example loading configuration that is similar tothe example of FIG. 11A, but in which a loading plate 330 can beutilized. As shown in FIG. 12A, such a loading plate can include anaperture corresponding to each aperture 302 of the plate 304 of theframe carrier 300. Such an aperture of the loading plate 330 can have abeveled wall 332 dimensioned to allow easier insertion of an individualunit being placed into the aperture 302 of the plate 304. Accordingly,the loading plate 330 can be positioned over the plate 304, such thatthe beveled-wall apertures of the loading plate 330 align appropriatelywith the corresponding apertures 302 of the plate.

In FIG. 12B, an individual unit 294 is shown to be inserted (arrow 450)into the aperture 302 of the plate 304. Such an insertion of theindividual unit 294 can be facilitated by the loading plate 330. It willbe understood that other individual units can be inserted into theirrespective apertures in a similar manner.

In FIG. 12C, the individual units 294 have been placed within therespective apertures (302) of the plate 304, and are being held thereinby a tape 306. Further, the loading plate (330) is shown to have beenremoved. Accordingly, and similar to the example of FIG. 11B, the plate304 and the individual units 294 held within the respective apertures bythe tape 306 (collectively indicated as 320) can allow the individualunits to be further processed as if they are still in a panel format.

In the examples of FIGS. 11 and 12, the tape 306 is pre-attached to theunderside of the plate 304 so as to receive and retain the individualunits placed in the apertures 302. In some applications, it may bedesirable to place the individual units within the apertures before sucha tape is applied.

FIGS. 13A-13E show an example of how individual units can be placedwithin an array of apertures of a frame carrier first, followed by anapplication of a tape to hold such individual units. FIG. 13A shows thatin some implementations, a vacuum apparatus 340 can be utilized totemporarily hold individual units in place prior to application of atape. For example, such a vacuum apparatus can include an array ofopenings 344, with each opening having a surface 342 configured toprovide suction. Such an opening can be dimensioned to match with acorresponding aperture 302 of a plate 304 of a frame carrier.

In some embodiments, the vacuum apparatus 340 can include elevatedportions dimensioned to support the plate 304 and define the opening344, such that an individual unit placed through the aperture 302 of theplate 304 can be positioned within the opening 344. In the example ofFIG. 13A, a loading plate 330 similar to the example of FIG. 12A isshown to be utilized. It will be understood that such a loading platemay or may not be utilized.

In FIG. 13B, an individual unit 294 is shown to be placed within theopening 344. It will be understood that other individual units can beplaced in their respective openings of the vacuum apparatus. Eachindividual unit 294 can engage the surface 342; and upon application ofsuction, be temporarily held within the opening.

In FIG. 13C, the loading plate (330) is shown to have been removed so asto expose the plate 304. In some embodiments, the opening (344) of thevacuum apparatus 340 and the plate 304 can be dimensioned such that theupper surface of the individual unit 294 is approximately co-planar withthe upper surface of the plate 304. Such a configuration can alloweasier application of a tape.

In FIG. 13D, a tape 306 is shown to be applied over the plate 304 andthe individual units 294. In the example orientation shown in FIG. 13D,the underside of the tape 306 can be the adhesive side, such that theindividual units 294 are now held within the apertures (302) of theplate 304 by the tape 306.

In FIG. 13E, an assembly of the individual units 294, the plate 304, andthe tape 306 are shown to have been separated from the vacuum apparatus(e.g., by turning off the suction). Accordingly, and similar to theexample of FIG. 11B, the plate 304 and the individual units 294 heldwithin the respective apertures by the tape 306 (collectively indicatedas 320) can allow the individual units to be further processed as ifthey are still in a panel format.

As described in reference to the examples of FIGS. 11-13, a framecarrier 300 that is loaded with an array of individual units can behandled for further processing as if the individual units are still in apanel format. For example, a plurality of such loaded frame carriers canbe inserted into a magazine for batch processing, similar to batchprocessing of panels. Such a magazine and related equipments can beconfigured for processing of panels. Because of the use of framecarriers, such processing equipments can also be utilized for batchprocessing of individual units with little or no modification.

In some embodiments, a frame carrier 300 having one or more features asdescribed herein can be configured to hold a plurality of singulateddevices during a process where shielding features are formed on each ofthe singulated devices. For example, conformal shielding layers can beformed on the singulated devices utilizing a layer-formation process(e.g., sputter deposition process). Additional details concerning such alayer-formation process on singulated devices being held by a framecarrier can be found in the above-referenced U.S. ProvisionalApplication No. 62/031,815.

FIG. 14 shows that in some embodiments, a frame carrier 300 havinghaving one or more features as described herein can have a shape otherthan the rectangular shape utilized in various examples. For example,the frame carrier 300 in FIG. 14 is shown to have a wafer-like form(e.g., circular shape). Such a shape can facilitate easierimplementation in some process step(s) (e.g., a sputter deposition step)in which an apparatus may be configured to hold a wafer.

In the example of FIG. 14, the frame carrier 300 is shown to include awafer-shaped plate 500 that defines an array of apertures 502 forreceiving singulated devices. In some embodiments, the plate 500 canalso include one or more tape removal features such as notches 506configured to facilitate easier removal of a tape (not shown) that canbe provided on the underside of the plate 500. In some embodiments, theplate 500 can also include one or more indexing and/or alignmentfeatures. In some embodiments, some or all of the tape removal featurescan be utilized for providing such indexing and/or alignmentfunctionalities.

In the example of FIG. 14, the apertures 502 are depicted as beingarranged throughout the entire region of the plate 500. In somedeposition applications, there may be a distribution in deposition rateas a function of, for example, angle relative to a center axis. In sucha situation, it may be desirable to position the apertures 502 in aselected annular region.

FIG. 15 shows an example configuration where a selected annular region510 defines a plurality of apertures 502 for holding singulated devicesduring a deposition process (e.g., a sputter deposition process). Thus,when the frame carrier 300 is rotated about the center axis during thedeposition process, formation of the conformal shielding layers can beachieved with a desired deposition rate and desired uniformity.

In the example of FIG. 15, the apertures 502 are depicted as beingpresent within the annular region 510. It will be understood that theremay be other apertures on the same plate 500, such as in the example ofFIG. 14. In such an example, only selected apertures (e.g., ones in theannular region) can be loaded with singulated devices to achieve similarfunctionality.

It will also be understood that the apertures 502 in FIGS. 14 and 15 donot necessarily need to be arranged in a rectangular arrangement inwhich the neighboring sides of the apertures are parallel. In someembodiments, apertures can be arranged to be in a non-rectangulararrangement. For example, such apertures can be arranged with circularsymmetry about the center axis.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Description using the singularor plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A device for processing singulated radio-frequency (RF) packages, the device comprising a plate having a plurality of apertures, each aperture dimensioned to receive and position a singulated RF package to thereby facilitate processing of the singulated RF packages positioned in their respective apertures.
 2. The device of claim 1 wherein each of the apertures has a rectangular shape having dimensions selected to allow the receiving and positioning of the singulated RF package therein.
 3. The device of claim 2 wherein the aperture includes a relief feature at one or more corners of the rectangular shaped aperture, each relief feature dimensioned to allow fitting of a corresponding corner of the singulated RF package.
 4. The device of claim 1 wherein the plate includes one or more features configured to provide indexing and/or alignment functionality.
 5. The device of claim 4 wherein the plate has a rectangular shape.
 6. The device of claim 5 wherein at least some of the one or more indexing/alignment features are positioned along a selected edge of the rectangular plate.
 7. The device of claim 1 wherein the plate includes an upper side and a lower side, the lower side configured to receive a tape such that the apertures expose respective portions of an adhesive side of the tape to thereby facilitate holding of the singulated RF packages positioned in the apertures.
 8. The device of claim 7 wherein the plate includes one or more tape-removal features configured to facilitate removal of the tape from the lower side of the plate.
 9. The device of claim 8 wherein the one or more tape-removal features includes one or more notches implemented on a selected edge of the plate.
 10. The device of claim 1 wherein the plate has a wafer-like shape.
 11. The device of claim 1 wherein the apertures are dimensioned to receive and position the singulated RF packages to facilitate a conformal shield deposition process.
 12. The device of claim 1 wherein the plate has a thickness selected to allow the singulated RF packages to be positioned and retained in their respective apertures in a desired manner during the processing of the singulated RF packages.
 13. A method for processing singulated radio-frequency (RF) packages, the method comprising: positioning a plurality of singulated RF packages into respective apertures defined by a plate, such that the singulated RF packages are held in a desired array; and performing one or more process steps on the singulated RF packages while the singulated RF packages are held by the plate.
 14. The method of claim 13 further comprising applying a tape on one side of the plate prior to the positioning of the singulated RF packages into the apertures, such that respective portions of an adhesive side of the tape are exposed through the apertures to thereby facilitate the holding of the singulated RF packages.
 15. The method of claim 13 further comprising applying vacuum to the singulated RF packages positioned in their respective apertures of the plate.
 16. The method of claim 15 further comprising applying a tape on one side of the plate after the singulated RF packages are being held by the vacuum, such that respective portions of an adhesive side of the tape engage the plate and portions of the singulated RF packages exposed through the apertures.
 17. The method of claim 16 further comprising removing the vacuum applied to the singulated RF packages.
 18. A system for batch processing of singulated radio-frequency (RF) packages, the system comprising: an apparatus configured for holding singulated RF packages, the apparatus including a plurality of frame carriers, each frame carrier having a plurality of apertures dimensioned to receive and position an array of singulated RF packages; and a handling apparatus configured to receive the plurality of frame carriers, each frame carrier loaded with the array of singulated RF packages, the handling apparatus further configured to allow batch processing of the singulated RF packages loaded in their respective frame carriers.
 19. The system of claim 18 wherein the apparatus for holding singulated RF packages includes a loading plate configured to be positioned over a frame carrier as the respective array of RF packages are being positioned in the apertures, the loading plate including a plurality of loading apertures, each loading aperture including beveled side walls dimensioned to facilitate easier positioning of the RF package into the corresponding aperture of the frame carrier.
 20. The system of claim 18 wherein the handling apparatus includes a magazine configured to receive the plurality of loaded frame carriers, the magazine further configured to facilitate the batch processing of the singulated RF packages loaded in the frame carriers as if they are still in a panel format. 